The Copper Plating Equipment Line is an efficient, high-precision plating solution designed for modern industrial needs. This production line combines advanced automation technology and flexible process flow, aiming to provide customers with superior plating quality, significant increase in productivity and reliable operational stability. Copper Plating Equipment Line is a series of equipment used for copper plating on substrate surfaces, which is widely used in electronics, automotive, construction, hardware and other industries. The chemical copper plating equipment line provides a cutting-edge solution for depositing high-quality, uniform copper layers onto a wide range of substrates without the need for external current. This chemical plating process is especially important for applications that require precise and consistent coatings on complex geometries, non-conductive materials (when properly activated), and through-hole metallisation in printed circuit board (PCB) manufacturing. With excellent adhesion and good conductivity, chemically plated copper is an important base for subsequent plating processes.