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Copper foil thinning etching machine

Copper Foil Thinning Etching Machine is a precision equipment specially designed for high-precision thickness thinning and graphic processing of electrolytic copper foil or calendered copper foil, which is mainly used in the fields of high-density interconnection (HDI) circuit boards, IC carrier boards, flexible electronics, and Li-ion battery collectors.

Category :
Etching Equipment
Browse number : ...
Release time : 2025-11-18

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Detailed Description

Main technical parameters

Parametric	Standard Scope	Note
Applicable copper foil thickness	0.006-0.07mm	<8μm need to be equipped with a low-tension suspension transfer system.
Thinning accuracy	±0.3-0.8μm	Thickness detection resolution 0.1μm
Etching rate	1-5μm/min（two-sided）	Rate positively correlated with temperature (+7% per 1°C increase in rate)
Minimum Line Width	15μm（thinned）	Calendered copper foils are superior to electrolytic copper foils due to the crystalline orientation of the copper foils
Copper recovery rate	≥99%	Recovery of copper sponge through electrolytic regeneration systems