Product Description and Features

The continuous copper plating production line using a fluid collection system is a critical process in the manufacturing of high-performance energy storage devices such as lithium-ion batteries and supercapacitors.

1. Core Purpose and Definition

Current collector: In a battery, it serves as the substrate that supports the active material and collects the current. The negative electrode is typically copper foil, as copper remains stable at low potentials (does not alloy with lithium).
Continuous Copper Plating: A dense, uniform copper layer is deposited onto a substrate material (such as PET/PI plastic film or ultra-thin rolled copper foil) via continuous roll-to-roll (R2R) electroplating. This process creates composite current collectors or enhances substrate properties.
Final Product: Ultra-thin, high-strength, highly conductive copper foil or composite copper foil is produced, primarily used for lithium-ion battery anodes.

2. Core Principle: Roll-to-Roll Electrodeposition

The fundamental principle is identical to conventional electroplating—both involve electrochemical deposition—but the implementation differs dramatically in its continuous dynamic production process.
Anode: Typically employs an insoluble anode, such as a titanium mesh coated with precious metal oxides (IrO₂, RuO₂) (DSA anode). In the sulfate copper plating system, the anode undergoes oxygen evolution reaction:
Cathode: The continuously moving substrate material (e.g., PET film).
Plating Solution: Primarily a sulfate-based acidic copper plating system containing copper sulfate, sulfuric acid, and additives.
Reaction Process:
At the Cathode (Substrate Material): Copper ions (Cu²⁺) in the plating solution gain electrons, reducing to metallic copper that deposits on the substrate surface to form the coating.
At the anode: Oxygen evolution occurs, consuming water and producing H⁺. Therefore, copper sources (typically copper(I) oxide or copper carbonate) must be periodically replenished to maintain copper ion concentration in the plating bath, unlike traditional electroplating which uses soluble copper anodes.

3. Technical Features and Advantages

Ultra-thin Capability: Capable of producing high-quality copper layers thinner than 6μm, a feat difficult to achieve with traditional rolling methods at a high cost.
Material Innovation: Enables the use of lightweight substrates like plastic to manufacture "composite current collectors" (e.g., PET copper foil), offering high safety (preventing thermal runaway during internal short circuits), high energy density (lightweighting), and excellent flexibility.
Uniformity: Achieves exceptionally uniform coating thickness through precise current control and delivery systems.
Continuity: Enables 24/7 uninterrupted production with high efficiency and low costs.

Product Specifications

Scope of Application